The project will go through the entire engineering cycle, from design to fabrication and validation of cases studies with focus on interconnects, antennas, and sensing devices for industrial and/or biomedical and/or smart packaging applications. The whole value chain, from material selection to technological improvement and final applications will be represented by user members playing leading role in each of the segment. Material focus is currently on metal and polymeric based conductive inks (silver inks, PEDOT:PSS, …) and flat & free form substrates (with focus on flexible foils to wrap on 3D shapes, and additive manufacturing substrates for in-situ mechatronics manufacturing. Pre- and post-treatment technologies (e.g. substrates functionalization, and sintering) wil be key to master high performance applications.